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  • In Tape-on-Reel packing
SMT (Surface Mount Technology) process is a modern module manufacturing process, focusing on cost-optimization through a fully automated process. PCB connectors suitable for THR (Through Hole Reflow) soldering method are loaded onto tape-on-reel packaging, which integrates these components into the automated SMT process. Dinkle offers tape-on-reel packaging method for PCB sockets ranging from pitches 3.5 mm to 7.62 mm, meeting the PCB requirements for SMT process. Vacuum nozzle or mechanical gripper tape-on-reel options are both available. With suction method, you have two options available for vertical or horizontal position depending on your application requirement.
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Item #

Item Name

Pitch Diameter

Current Rating

Rated Voltage

Level

N/A 3EHDR-XXPWR 0.300 Inch (in) Pitch Diameter In Tape-on-Reel Packing N/A 7.62 mm0.300 in N/A 25 A N/A 300 V N/A Single Level
N/A 3EHDRC-XXPWR 0.300 Inch (in) Pitch Diameter In Tape-on-Reel Packing N/A 7.62 mm0.300 in N/A 25 A N/A 300 V N/A Single Level
N/A 3EHDRM-XXPWR 0.300 Inch (in) Pitch Diameter In Tape-on-Reel Packing N/A 7.62 mm0.300 in N/A 25 A N/A 300 V N/A Single Level
N/A 3EHDV-XXPWR 0.300 Inch (in) Pitch Diameter In Tape-on-Reel Packing N/A 7.62 mm0.300 in N/A 25 A N/A 300 V N/A Single Level
N/A 3EHDVC-XXPWR 0.300 Inch (in) Pitch Diameter In Tape-on-Reel Packing N/A 7.62 mm0.300 in N/A 25 A N/A 300 V N/A Single Level
N/A 3EHDVM-XXPWR 0.300 Inch (in) Pitch Diameter In Tape-on-Reel Packing N/A 7.62 mm0.300 in N/A 25 A N/A 300 V N/A Single Level
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